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The advanced wafer fabrication facility is set to support around 3,000 new roles in total across Micron’s Singapore operations, as demand for AI-driven technologies continues to rise.
Micron Technology has broken ground on a new advanced wafer fabrication facility in Singapore, an expansion that is expected to create around 1,600 new jobs and strengthen the country’s position in the global semiconductor supply chain.
The new roles will add to the 1,400 jobs previously announced for Micron’s high-bandwidth memory (HBM) advanced packaging facility, bringing the total number of new Micron jobs in Singapore to about 3,000. These positions will focus mainly on fab engineering and operations, with an emphasis on AI, advanced robotics and smart manufacturing technologies.
Located within Micron’s existing NAND manufacturing complex, the new facility represents a planned investment of approximately US$24bn or equivalent to S$31bn over 10 years. Once completed, it will provide up to 700,000 square feet of cleanroom space, with wafer output scheduled to begin in the second half of 2028.
The groundbreaking ceremony was attended by Gan Kim Yong, Deputy Prime Minister and Minister for Trade and Industry, along with senior leaders Dr Beh Swan Gin, Permanent Secretary, Ministry of Trade and Industry, Jermaine Loy, Managing Director, Singapore Economic Development Board (EDB), and Jacqueline Poh, CEO, JTC Corporation.
According to Micron, the new facility will be a core part of its NAND Centre of Excellence in Singapore, providing capacity to support long-term manufacturing needs as demand for data-centric and AI-driven applications grows. By co-locating research and development with manufacturing, the company said the setup is expected to improve operational efficiency, accelerate time-to-market and strengthen collaboration with academic and industry partners.
The expansion builds on Micron’s wider manufacturing footprint in Singapore. Its HBM advanced packaging facility, which is located within the same manufacturing complex, remains on track to contribute to Micron’s global HBM supply from 2027. With HBM becoming part of its Singapore operations, Micron expects potential synergies across NAND and DRAM production, while maintaining flexibility to manage capacity in line with market demand.
From a workforce perspective, Micron said the investment will support skills development in advanced manufacturing. This includes creating pathways such as internships for students, upskilling opportunities for the existing workforce in AI and smart manufacturing, and the development of future innovation.
Jermaine Loy said the expansion would "provide good jobs for Singaporeans" while strengthening the local semiconductor ecosystem. He added: "Micron’s advanced facility will leverage advanced robotic automation and boost our advanced manufacturing ecosystem, helping our workforce seize new opportunities."
The new fab is said to align with Micron's sustainability commitments. The facility will adhere to LEED standards and build on the site’s existing recognition for energy efficiency and sustainability, with measures such as greenhouse gas abatement, water recycling and waste circularity.
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Lead image / Micron Singapore Facebook
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